LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for parallel subelement semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for power semiconductor device with snubber circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for sealing an integrated circuit die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Package for semiconductor device having a device-supporting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for semiconductor device laminated printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Package for semiconductor device with at least one through hole

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Package for semiconductor die containing symmetrical lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Package for semiconductor elements having thermal dissipation me

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Package for semiconductor power device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package having a structure for stabilizing and/or impedance-matc

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Package having bond-sealed underbump

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Package having shield case

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Package in package (PiP)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Package in package device for RF transceiver module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Package in package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Package lid or heat spreader for microprocessor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Package mounted module and package board module