Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2006-01-31
2006-01-31
Lebentritt, Michael (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S725000
Reexamination Certificate
active
06992380
ABSTRACT:
A semiconductor device39. The device includes an interposer31having two major surfaces. The first surface311includes patterned metal conductors and bond pads351, and the second surface includes an array of solder balls33. The device includes a semiconductor chip30having a top surface and a back surface, the back surface of the chip adjacent the interposer31, and the top surface including a plurality of terminals. Also included is a layer of polymeric material34disposed on the first surface311of the interposer covering the area of the interposer over the solder ball array. At least a portion of the polymeric material layer is between the chip30and the interposer31. The device further includes a plurality of electrical connections35between the chip terminals and the bond pads351on the interposer.
REFERENCES:
patent: 5874784 (1999-02-01), Aoki et al.
patent: 6020219 (2000-02-01), Dudderar et al.
patent: 6127724 (2000-10-01), DiStefano
patent: 6232661 (2001-05-01), Amagai et al.
patent: 6265782 (2001-07-01), Yamamoto et al.
patent: 6720209 (2004-04-01), Igarashi et al.
patent: 2002/0070462 (2002-06-01), Fujisawa et al.
Brady III Wade James
Lebentritt Michael
Stevenson Andre′
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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