Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-10-24
1999-12-21
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257774, 361751, 361803, H01L 23053, H01L 2348
Patent
active
060052899
ABSTRACT:
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.
Asai Katsunori
Hashimoto Tomoaki
Kurafuchi Kazuhiko
Narutaki Yoshikazu
Sawai Akiyoshi
Arroyo Teresa M.
Mitsubishi Denki & Kabushiki Kaisha
Ryoden Semiconductor System Engineering Corporation
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