Package in package (PiP)

Details Package in package (PiP) Package in package (PiP)

2005-06-27

2010-06-29

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S778000, C257SE25006

Reexamination Certificate

active

07745918

ABSTRACT:
A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.

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