Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2007-11-27
2007-11-27
Ngô, Ngân V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S692000, C257SE23061, C257SE23081
Reexamination Certificate
active
11207630
ABSTRACT:
A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provides electrical connections from the IC die to the lower surface of the substrate. The lid includes an outer lid and an inner lid. The inner lid is positioned over the IC die and is in thermal communication with the IC die. The inner lid is formed of a material suitable for conducting heat away from the IC die. The outer lid is attached to the upper surface of the substrate. A gap extends between the outer lid and inner lid.
REFERENCES:
patent: 5723904 (1998-03-01), Shiga
patent: 6724080 (2004-04-01), Ooi et al.
patent: 7084010 (2006-08-01), Kennedy et al.
patent: 2004/0251044 (2004-12-01), Choi et al.
patent: 2005/0253254 (2005-11-01), Neogi et al.
Gektin Vadim
Malladi Deviprasad
Martine & Penilla & Gencarella LLP
Ngo Ngan V.
Sun Microsystems Inc.
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