Package having shield case

Details Package having shield case Package having shield case

2011-03-22

2011-03-22

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S659000, C257S098000, C257SE23191, C257SE23193

Reexamination Certificate

active

07911042

ABSTRACT:
A package includes: a package body including a substrate, an electronic component mounted on a first surface of the substrate, and a sealing resin layer for sealing the electronic component; and a shield case for covering the sealing resin layer, the shield case being made of metal and having an inverted U-shape in a cross-sectional view, wherein a bent part of the shield case is formed in such a manner that at least a part of an end of the shield case is bent toward a second surface of the substrate opposite to the first surface, and the bent part abuts on the second surface so that the shield case is attached to the substrate.

REFERENCES:
patent: 6687135 (2004-02-01), Kitade
patent: 2004/0159926 (2004-08-01), Moriwaki
patent: 2006/0177083 (2006-08-01), Sjursen et al.
patent: 2006/0202041 (2006-09-01), Hishizawa et al.
patent: 10-284935 (1998-10-01), None

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