Package for semiconductor device with at least one through hole

Details Package for semiconductor device with at least one through hole Package for semiconductor device with at least one through hole

1991-05-22

1993-10-26

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257693, 257692, 361829, H01L 2302

Patent

active

052569004

ABSTRACT:
A package for semiconductor devices formed by brazing a metallic frame and an insulating substrate having metallized patterns for electrically connecting the electrodes of semiconductor elements mounted thereon to the outside, which can reduce the warp in the package generated during the brazing assembly due to the difference in the coefficients of thermal expansion, and can reduce the cracks in the insulating substrate that tend to be created during the brazing assembly due to the thermal stresses. Through holes are drilled in the metallic frame in more than at least one place of the metallic frame.

REFERENCES:
patent: 4918511 (1990-04-01), Brown
patent: 4942454 (1990-07-01), Mori et al.
patent: 4952999 (1990-08-01), Robinson et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5036584 (1991-08-01), Beauregard et al.
patent: 5063434 (1991-11-01), Emoto

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