Package having bond-sealed underbump

Details Package having bond-sealed underbump Package having bond-sealed underbump

2006-06-06

2008-10-28

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S682000, C257S704000, C257S431000, C257SE23095, C257SE23137, C438S116000

Reexamination Certificate

active

07443017

ABSTRACT:
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.

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MSDS for Cyclotene® 4026-46 Advanced Electronics Resin, The Dow Chemical Co., Midland, MI, 10 pages, Nov. 20, 2001.
MSDS for Cyclotene® 4022-35 Advanced Electronics Resin, The Dow Chemical Co., Midland, MI, pages, Nov. 20, 2001.
Sammon, T. et al., “A New Generation of Wafer Level Packaged HEXFET® Devices,” International Rectifier, 4 pages, as presented at PCIM Europe 2000.

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