Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-03-22
2011-03-22
Richards, N Drew (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S713000, C257S714000, C257S716000, C257S717000, C438S122000
Reexamination Certificate
active
07911052
ABSTRACT:
The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.
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Chrysler Gregory Martin
Maveety James G.
Vadakkanmaruveedu Unnikrishnan
Intel Corporation
Konrad Raynes & Victor LLP
Raynes Alan S.
Richards N Drew
Sun Yu-Hsi
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