Nested integrated circuit package on package system

Details Nested integrated circuit package on package system Nested integrated circuit package on package system

2007-10-09

2007-10-09

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S724000

Reexamination Certificate

active

11257894

ABSTRACT:
A package on package system is provided including providing a first substrate having a first integrated circuit thereon and a second substrate having a second integrated circuit thereon, the second substrate having a recess provided therein. The first and second substrates are mounted having the first integrated circuit at least partially nested in the recess.

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