NANO IC packaging

Details NANO IC packaging NANO IC packaging

2006-03-28

2006-03-28

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S666000, C257S677000, C257S672000, C257S098000

Reexamination Certificate

active

07019391

ABSTRACT:
Systems and methods are disclosed to dissipate heat from a semiconductor substrate. A package for integrated circuit includes a chip having a plurality of chip pads adapted to receive the variety of signals from or to output the same to an external circuit; a lead frame having a plurality of contact points each corresponding to a chip pad; and nano ceramic material in thermal communication with the chip for removing heat from the chip.

REFERENCES:
patent: 4541908 (1985-09-01), Niki et al.
patent: 4668932 (1987-05-01), Drori et al.
patent: 5063521 (1991-11-01), Peterson et al.
patent: 5084365 (1992-01-01), Gratzel et al.
patent: 5084667 (1992-01-01), Drori et al.
patent: 5093664 (1992-03-01), Senn et al.
patent: 5109204 (1992-04-01), Keefer
patent: 5161157 (1992-11-01), Owen et al.
patent: 5298858 (1994-03-01), Harrison
patent: 5581198 (1996-12-01), Trimberger
patent: 5946034 (1999-08-01), Cortiula
patent: 5977565 (1999-11-01), Ishikawa et al.
patent: 6331768 (2001-12-01), Drori et al.
patent: 6366318 (2002-04-01), Smith et al.
patent: 6500571 (2002-12-01), Liberatore et al.
patent: 6570523 (2003-05-01), Bacrania et al.
patent: 6576938 (2003-06-01), Hirama et al.
patent: 6605836 (2003-08-01), Kishi et al.
patent: 6671166 (2003-12-01), Penneau et al.
patent: 6690599 (2004-02-01), Hasegawa et al.
patent: 2001/0023986 (2001-09-01), Mancevski
patent: 2001/0044114 (2001-11-01), Connelly
patent: 2002/0027124 (2002-03-01), Bashir
patent: 2002/0094515 (2002-07-01), Erlach et al.
patent: 2002/0096472 (2002-07-01), Erlach et al.
patent: 2002/0096633 (2002-07-01), Gimzewski et al.
patent: 2002/0114557 (2002-08-01), Zhang et al.
patent: 2002/0139961 (2002-10-01), Kinoshita et al.
patent: 2002/0150524 (2002-10-01), Smalley et al.
patent: 2002/0154535 (2002-10-01), Bocian et al.
patent: 2002/0158374 (2002-10-01), Billiet et al.
patent: 2002/0163414 (2002-11-01), Mayer et al.
patent: 2002/0174660 (2002-11-01), Venkatasubramanian
patent: 2003/0003300 (2003-01-01), Korgel
patent: 2003/0064532 (2003-04-01), Chen
patent: 2003/0081463 (2003-05-01), Bocian et al.
patent: 2003/0082444 (2003-05-01), Kuhr et al.
patent: 2003/0089899 (2003-05-01), Lieber et al.
patent: 2003/0111670 (2003-06-01), Misra et al.
patent: 2003/0136943 (2003-07-01), Alivisatos et al.
patent: 2003/0138777 (2003-07-01), Evans
patent: 2003/0139907 (2003-07-01), McCarthy
patent: 2003/0141189 (2003-07-01), Lee et al.
patent: 2003/0145779 (2003-08-01), Alivisatos et al.
patent: 2003/0146095 (2003-08-01), Edman et al.
patent: 2003/0169618 (2003-09-01), Lindsey et al.
patent: 2003/0171257 (2003-09-01), Stirbl et al.
patent: 2003/0174384 (2003-09-01), Halas et al.
patent: 2003/0177450 (2003-09-01), Nugent
patent: 2003/0178617 (2003-09-01), Appenzeller et al.
patent: 2003/0186522 (2003-10-01), Duan et al.
patent: 2003/0189402 (2003-10-01), Gaudiana et al.
patent: 2003/0200521 (2003-10-01), De Hon et al.
patent: 2003/0207978 (2003-11-01), Yadav et al.
patent: 2003/0209810 (2003-11-01), Moon et al.
patent: 2003/0215903 (2003-11-01), Nyman et al.
patent: 2003/0230746 (2003-12-01), Stajiak
patent: 2004/0002064 (2004-01-01), Fang et al.
patent: 2004/0016318 (2004-01-01), Angeliu
patent: 2004/0029708 (2004-02-01), Valant et al.

Affiliated with

Also associated with

Rating

NANO IC packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with NANO IC packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and NANO IC packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3529670