NANO IC packaging

Details NANO IC packaging NANO IC packaging

2006-01-26

2008-05-20

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23033, C257SE27151

Reexamination Certificate

active

07375417

ABSTRACT:
A package for an integrated circuit includes a chip having a plurality of nodes adapted to receive signals from or to output signals to an external circuit; and a frame having a plurality of contact points each coupled to one node of the chip and to a pad, wherein each pad comprises a nano material.

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