Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1996-04-09
1998-01-06
Whitehead, Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257783, 257780, H01L 2302
Patent
active
057058520
ABSTRACT:
In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.
REFERENCES:
patent: 5448110 (1995-09-01), Tuttle et al.
patent: 5598032 (1997-01-01), Fidalgo
Fujimoto Masahiro
Kurita Hideyuki
Monkawa Haruo
Orihara Katsuhisa
Clark S. V.
Sony Chemicals Corp.
Whitehead Carl W.
LandOfFree
Non-contact IC card and process for its production does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Non-contact IC card and process for its production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-contact IC card and process for its production will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2331808