Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1995-12-22
1999-09-14
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257678, 257723, 257790, 361737, H01L 2302, H01L 2334, H01L 2329
Patent
active
059527137
ABSTRACT:
A non-contact IC card and a method and apparatus for manufacturing the IC card. The IC card has a small thickness and is manufactured at a low cost, automatically. Electronic parts are mounted on a circuit pattern on a surface of a resin sheet. A filling resin covers the elcetronic parts and fills gaps between them. An electronically insulating plastic material on the filling resin wraps around the filling resin, contacting its side surfaces and saide surfaces of the resin sheet. The plastic material provides added protection to the electronic parts. In a method of manufacturing the non-contact IC card, the laminated structure of the resin sheet, filling resin, and plastic material is subjected to two sequential severing steps. In the first severing step, only the resin sheet and the filling resin are severed, generally in the shape of an IC card that is to be completed. The plastic material is not severed and extends over side surfaces of the resin sheet and filling that are produced in the first cutting step. The plastic material is severed so that it extends beyond the side surfaces of the resin filling material and resin sheet. Finally, the overhanging parts to the resin material are deformed and bent to cover and protect the side surfaces of the resin sheet and the filling resin.
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Murasawa Yasuhiro
Ohbuchi Jun
Takahira Kenichi
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