Nanotube modified solder thermal intermediate structure,...

Details Nanotube modified solder thermal intermediate structure,... Nanotube modified solder thermal intermediate structure,...

2007-02-20

2007-02-20

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S720000, C257S778000

Reexamination Certificate

active

10747927

ABSTRACT:
An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.

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