Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2006-01-03
2006-01-03
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S778000, C257S787000
Reexamination Certificate
active
06982480
ABSTRACT:
A near-hermetic microwave semiconductor device, suitable for wideband high frequency applications including Phased Array Antenna systems, includes a PWB as a substrate; a GaAs Monolithic Microwave Integrated Circuit (MMIC) disposed on the substrate; a silicon carbide sealant disposed on the MMIC; and a Backside Interconnect with solder attachment which connects the substrate to the silicon carbide-coated MMIC. A conformal coating is disposed on the sealant, and a cover is disposed on the conformally-coated MMIC.
REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 5023624 (1991-06-01), Heckaman et al.
patent: 5396403 (1995-03-01), Patel
patent: 5572070 (1996-11-01), Ross
patent: 5945734 (1999-08-01), McKay
patent: 6249136 (2001-06-01), Maley
patent: 6462405 (2002-10-01), Lai et al.
patent: 6525420 (2003-02-01), Zuo et al.
patent: 6710542 (2004-03-01), Chun et al.
patent: 2002/0153616 (2002-10-01), Kunihisa et al.
patent: 2003/0151133 (2003-08-01), Kinayman et al.
Peter P. Black and Donald E. Dunstone, “Development of Plastic Encapsulated Microcircuit Coating Processes Form Military Applications”, Army RD&A, Jan.-Feb. 2000, pp. 8-11, Department of the Army.
Cao Phat X.
Sonnenschein Nath & Rosenthal LLP
The Boeing Company
LandOfFree
Near hermetic packaging of gallium arsenide semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Near hermetic packaging of gallium arsenide semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Near hermetic packaging of gallium arsenide semiconductor... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3538913