LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink clip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink design using clad metal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink dissipator for adapting to thickness change of a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink fin assembly for cooling an LSI package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink for a high capacity thin module system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for plastic casings

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for semiconductor components or similar devices,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink for semiconductors and manufacturing process thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink for use in cooling an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink formed of diamond-containing composite material...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink formed of multiple metal layers on backside of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink having good heat dissipating characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink mounting system for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink unit for cooling a plurality of exothermic units,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink with collapse structure and semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink with collapse structure for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Heat sink with cooling fins for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Heat sink with elevated heat spreader lid