Heat sink for semiconductor components or similar devices,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Details

C257S706000, C257S718000, C257S722000, C165S080300, C165S185000, C174S016300, C361S697000, C361S703000

Reexamination Certificate

active

07009290

ABSTRACT:
A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and which are clamped in an insert groove made in the surface of the base plate, laterally limited by longitudinal or intermediate ribs with a coupling base that has an approximately rectangular cross-section. The coupling bases are held in their insert grooves in a form-fit and are cold-welded with the base plate at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base in a form-fit.

REFERENCES:
patent: 3163207 (1964-12-01), Schultz
patent: 6000462 (1999-12-01), Gonner
patent: 6505680 (2003-01-01), Hegde
patent: 25 02 472 (1982-09-01), None
patent: 35 18 310 (1986-11-01), None
patent: 35 18310 (1986-11-01), None
patent: 199 00 970 (2000-07-01), None
patent: 101 57 240 (2001-11-01), None
patent: 09321186 (1997-12-01), None

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