Heat sink having good heat dissipating characteristics

Details Heat sink having good heat dissipating characteristics Heat sink having good heat dissipating characteristics

1993-03-09

1998-03-10

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 361697, 361703, 361718, 165 803, H01L 2334

Patent

active

057264953

ABSTRACT:
A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group comprising a plurality of plane parallel plates or pins that are integral with the bottom plate.

REFERENCES:
patent: 3180404 (1965-04-01), Nelson et al.
patent: 3961666 (1976-06-01), Suzuki et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4459638 (1984-07-01), Brehm et al.
patent: 4694378 (1987-09-01), Nakayama et al.
patent: 4698663 (1987-10-01), Sugimoto et al.
patent: 4823869 (1989-04-01), Arnold et al.
patent: 4879891 (1989-11-01), Hinshaw
patent: 4884331 (1989-12-01), Hinshaw
patent: 4884631 (1989-12-01), Rippel
patent: 4899210 (1990-02-01), Lorenzetti et al.
patent: 5003429 (1991-03-01), Baker et al.
patent: 5083194 (1992-01-01), Bartilson
patent: 5155579 (1992-10-01), AuYeung
"The Application of Two-Phase Push-Pull Cooling Module in Pin-fin array Electronic Device," Yu-Lin Chao and Fang-Lin Chao, (Eighth Annual IEEE Semi Conductor Thermal Measurement and Management Symposium, Feb. 3-5, 1992) pp. 97-100.
Electronics Int'l., 55(17):46-48 (Aug. 1982).

Affiliated with

Also associated with

Rating

Heat sink having good heat dissipating characteristics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink having good heat dissipating characteristics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink having good heat dissipating characteristics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-142126