Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-07-05
2005-07-05
Zarneke, David A. (Department: 2829)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S707000
Reexamination Certificate
active
06914330
ABSTRACT:
A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.
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Kneringer Günter
Lüdtke Arndt
Greenberg Laurence A.
Locher Ralph E.
Plansee Aktiengesellschaft
Stemer Werner H.
Zarneke David A.
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