Heat sink fin assembly for cooling an LSI package

Details Heat sink fin assembly for cooling an LSI package Heat sink fin assembly for cooling an LSI package

1995-10-03

1997-04-29

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257722, 361697, 361709, 361717, H01L 2334

Patent

active

056252293

ABSTRACT:
A heat sink fin assembly of the corrugated type for cooling an LSI package comprises a flat base plate and a heat dissipating member made of a thin metal sheet having convex and concave portions which are comprised of a repeated series of side wall portions, top portions, and bottom portions. The base plate and the heat dissipating member are integrated with each other by bonding.

REFERENCES:
patent: 4858072 (1989-08-01), Chall, Jr.
patent: 5304846 (1994-04-01), Azar et al.
patent: 5358032 (1994-10-01), Arai et al.
patent: 5455382 (1995-10-01), Kojima et al.

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