Heat sink mounting system for semiconductor devices

Details Heat sink mounting system for semiconductor devices Heat sink mounting system for semiconductor devices

1992-06-05

1994-02-01

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257719, 257722, 361704, 361707, 165 803, 174 163, H01L 2302

Patent

active

052834670

ABSTRACT:
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.

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