Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2001-08-08
2002-11-05
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S712000, C257S713000, C257S706000, C257S718000, C257S719000, C257S722000, C257S723000, C257S724000, C257S725000, C257S726000, C257S727000, C361S703000, C361S704000, C439S071000, C439S072000, C439S073000, C439S487000
Reexamination Certificate
active
06476484
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a heat sink dissipater, and more particularly to a beat sink dissipater for use with a combination of a CPU and a CPU carrier of different thickness so that a new mold for a heat dissipater for adapting to a combination of a CPU and a PC board with specific thickness is not necessary.
BACKGROUND OF THE INVENTION
With reference to
FIG. 1
, a CPU assembly normally has a CPU
10
mounted on a PC board
11
and a main board
12
securely engaged with the PC board
11
. That is, a combination of the CPU
10
, the PC board
11
and the main board
12
has thickness A. When a conventional heat dissipater is to be mounted on the CPU
10
for dissipating beat generated by the operation of the CPU
10
, a retaining device
20
is necessary.
The retaining device
20
has two retaining edges
21
respectively formed on opposite sides of the retaining device
20
. Bach retaining edge is formed with a barb
211
. Multiple resilient legs
22
respectively extend inward from sides of the retaining device
20
adjacent to the sides of the retaining edges
21
, and each resilient leg has a bent
221
.
When the retaining device
20
is employed to fix the conventional heat dissipater with multiple columns and rows of fins onto the CPU
10
, the resilient legs
22
extend into gaps between fins and the bents
221
engage the top face of the CPU
10
to abut the CPU
10
to the PC board
11
. Then the retaining edges
21
secure the PC board
11
by means of the barbs
211
. However, when another combination having only the CPU
10
and the main board
12
and thus having less thickness compared to the thickness of the previously described combination is used and the same conventional heat dissipater has to be used to dissipate the heat from the CPU
10
, a new retaining device is to be developed to adapt to the variation in thickness. Changing the thickness of the combination of the CPU assembly often means a new retaining device or a new heat dissipater, which is quite a waste in cost.
To overcome the shortcomings, the present invention intends to provide an improved heat dissipater to mitigate or obviate the aforementioned problems.
SUMMARY OF THE INVENTION
The primary objective of the invention is to provide a heat sink dissipater having multiple pads integrally formed on the heat sink dissipater so that when the thickness of the combination of the CPU and the CPU carrier is reduced, the bents of the resilient legs can still engage the pads to securely fix the heat sink dissipater onto the CPU.
Another objective of the invention is to provide a heat sink dissipater having multiple recesses integrally formed on the heat sink dissipater so that when the thickness of the combination of the CPU and the CPU carrier is increased, the bents of the resilient legs can still engage bottom faces defining the recesses to securely fix the heat dissipater onto the CPU.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5421402 (1995-06-01), Lin
patent: 5660562 (1997-08-01), Lin
patent: 6015301 (2000-01-01), Brodsky et al.
patent: 6086387 (2000-07-01), Gallagher et al.
patent: 6201697 (2001-03-01), McCullough
patent: 6243266 (2001-06-01), Lo
Erdem Fazli
Flynn Nathan J.
Malico Inc.
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