Heat sink design using clad metal

Details Heat sink design using clad metal Heat sink design using clad metal

2006-03-28

2008-11-04

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23102, C257SE23103, C257SE23107, C257S720000, C257S719000, C257S712000, C257S713000, C029S890030, C029S890039, C029S890041, C029S840000, C029S832000, C029S835000, C165S133000, C165S185000, C165S080300

Reexamination Certificate

active

07446412

ABSTRACT:
Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.

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