Heat sink formed of multiple metal layers on backside of...

Details Heat sink formed of multiple metal layers on backside of... Heat sink formed of multiple metal layers on backside of...

2004-06-29

2010-06-29

Trinh, Hoa B (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S718000, C257S720000, C257SE33075

Reexamination Certificate

active

07745927

ABSTRACT:
An integrated circuit die includes a substrate having a front surface and a back surface, wherein the substrate front surface has electrical circuits formed thereon, and the substrate back surface has a plurality of metal layers formed thereon. The plurality of metal layers comprises at least one layer having a thickness of greater than about ten micrometers. The outermost metal layer may be mechanically and thermally bonded to a package using a die attach layer comprising a thermally conductive reflowable material. The invention advantageously facilitates the dissipation of heat from the integrated circuit die.

REFERENCES:
patent: 4080722 (1978-03-01), Klatskin et al.
patent: 4451972 (1984-06-01), Batinovich
patent: 4722130 (1988-02-01), Kimura et al.
patent: 4866505 (1989-09-01), Roberts et al.
patent: 5027997 (1991-07-01), Bendik et al.
patent: 5635010 (1997-06-01), Pepe et al.
patent: 5773362 (1998-06-01), Tonti et al.
patent: 6350634 (2002-02-01), Ma

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