Heat sink for plastic casings

Details Heat sink for plastic casings Heat sink for plastic casings

1994-08-08

1997-10-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257796, 165 803, 361709, 361717, H01L 2334, H01L 2328

Patent

active

056751826

ABSTRACT:
A heat sink for mounting a semiconductor chip in a plastic casing. The upper surface of the heat sink is in thermal contact with the semiconductor chip, the lower surface is coplanar with a main surface of the casing. The heat sink is formed from a substantially square sheet of metal having each of its corners folded as a tongue to provide a substantially square base, each of the folded tongues forming the lower surface of the base.

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patent: 5311395 (1994-05-01), McGaha et al.
Patent Abstracts of Japan, vol. 008, No. 074 (E-236), Apr. 6, 1984 & JP-A-58 223 353.
Patent Abstracts of Japan, vol. 013, No. 235 (E-766), May 30, 1989 & JP-A-01 041 253.
Patent Abstracts of Japan, vol. 013, 544 (E-855) Dec. 6, 1989 & JP-A-01 225 190.

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