Heat sink clip assembly

Details Heat sink clip assembly Heat sink clip assembly

1990-04-02

1997-07-29

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257717, 165 803, 174 163, 361704, 361718, H01L 2334, H05K 720, F28F 700

Patent

active

RE0355739

ABSTRACT:
Disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package. The frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like. A resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame. The clip includes means for releasably gripping the heat sink. The heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom.

REFERENCES:
patent: Re29080 (1976-12-01), Kiko
patent: Re30597 (1981-05-01), Grindheim
patent: Re32087 (1986-02-01), Hamprecht et al.
patent: Re33549 (1991-03-01), Weigert
patent: Re33719 (1991-10-01), Levin
patent: 4000509 (1976-12-01), Jarvela
patent: 4660123 (1987-04-01), Hermann
patent: 5019940 (1991-05-01), Clemens

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