LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Array capacitors in interposers, and methods of using same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Array printed circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Array-molded package heat spreader and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Arrayable, scaleable, and stackable molded package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Article comprising a multi-layer electronic package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Article comprising a superconducting RF filter

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Article having metal impregnated within carbon nanotube array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Assemblies and multi-chip modules including stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Assemblies and packages including die-to-die connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Assemblies having stacked semiconductor chips and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Assemblies having stacked semiconductor chips and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Assemblies having stacked semiconductor chips and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Assembling stacked substrates that can form cylindrical...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Assembly and methods for packaged die on pcb with heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Assembly for dissipatating heat from a semiconductor chip wherei

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Assembly for dissipating heat from a stacked semiconductor packa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Assembly for mounting an electronic device having an optically e

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Assembly for mounting power semiconductive modules to heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Assembly for stacked BGA packages