Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-12-07
2010-06-01
Garber, Charles D (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S724000, C257S777000, C257S778000, C257SE23010, C257SE23041, C257SE23057, C257SE23171, C336S040000, C336S073000, C438S107000, C438S108000
Reexamination Certificate
active
07728427
ABSTRACT:
A system is described that can assemble substrates over one another to form a stacked substrate. The various layers of the stacked substrate can be separated from each other by using Coulomb forces. In addition, a beam substrate can be used to increase the separation. The instructions for assembly and a FSM (Finite State Machine) can be included in the stacked substrate to pave the way for a self-constructing 3-D automaton. The beam substrate can be used to carry heat, fluids, electrical power or signals between the various layers of the stacked cells besides providing a mechanical support. A stacked substrate can be assembled into a cylindrical coil, a transformer or a coupled transformer depending on the construction of the beam structure. The magnetic coupling of the transformer can be altered by changing the distance between the separated substrates.
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Abdelaziez Yasser A
Gabara Thaddeus
Garber Charles D
LCtank LLC
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