Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-07-04
2006-07-04
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000
Reexamination Certificate
active
07071547
ABSTRACT:
A stacked microelectronic assembly comprises a continuous sheet including a core panel and a plurality of side panels, each having a folded portion that connects the side panel to an edge of the core panel. At least two of the panels are at least partially horizontally aligned with one another in a stack. During manufacture of a stacked microelectronic assembly, failed microelectronic elements are identified and associated side panels thereof are simply cut-off. This results in the production of a usable stacked microelectronic assembly albeit of reduced capacity, or reduced functionality.
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Kang Teck-Gyu
Kubota Yoichi
Clark S. V.
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
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