Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-02-28
2006-02-28
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S724000
Reexamination Certificate
active
07005735
ABSTRACT:
The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.
REFERENCES:
patent: 4733461 (1988-03-01), Nakano
patent: 6227867 (2001-05-01), Chen et al.
patent: 6307769 (2001-10-01), Nuxoll et al.
patent: 09-223856 (1997-08-01), None
patent: 9223856 (1997-08-01), None
patent: 10-150295 (1998-06-01), None
Korean Office Action, dated Jan. 24, 2005, with English translation.
Choi Jong-Soo
Chun Kwang-Ho
Kim Byung-Man
Park Chang-Yong
Ryu Se-Hyung
Harness & Dickey & Pierce P.L.C.
Ho Tu-Tu
Samsung Electronics Co,. Ltd.
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