Assemblies and packages including die-to-die connections

Details Assemblies and packages including die-to-die connections Assemblies and packages including die-to-die connections

2005-06-14

2005-06-14

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S724000, C257S777000

Reexamination Certificate

active

06906408

ABSTRACT:
A semiconductor device assembly includes a first semiconductor die, such as a logic device, with bond pads arranged in an array on an active surface thereof, and at least one second semiconductor die, such as a memory device or an ancillary or parallel logic device, with bond pads on an active surface thereof with active surfaces thereof facing each other. Corresponding bond pads of the first and at least one second semiconductor dice are connected to each other by way of conductive structures disposed therebetween. The package includes the assembly and a carrier, such as a carrier substrate or leads. The first semiconductor die is oriented over the carrier such that bond pads thereof that are exposed beyond the periphery of each second semiconductor die face the carrier and are electrically connected to corresponding contacts thereof.

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