LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials

Adhesive sheet for producing a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Adhesive tape, connected structure and semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Adhesively sealed metal electronic package incorporating a multi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Adjustable spacer for flat plate cooling applications

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Adjustable thickness thermal interposer and electronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Adjustable threaded cores for LED thermal management

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Adjustable-pressure mount heatsink system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Advanced RF electronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Affordable high performance high frequency multichip module...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Air-packed CCD images package and a mold for manufacturing there

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Airgap micro-spring interconnect with bonded underfill seal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Alignment pedestals in an LDMOS power package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Aluminum and aluminum alloy radiator for semiconductor device an

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Aluminum-silicon carbide semiconductor substrate and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Aluminum/ceramic bonding substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Anchor for device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Angled edge connections for multichip structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Angled edge connections for multichip structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Angularly offset and recessed stacked die multichip device...