Aluminum and aluminum alloy radiator for semiconductor device an

Details Aluminum and aluminum alloy radiator for semiconductor device an Aluminum and aluminum alloy radiator for semiconductor device an

1997-05-21

1999-04-06

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257707, 257796, H01L 2310, H01L 2334

Patent

active

058922784

ABSTRACT:
An aluminum or aluminum alloy radiator possessing high reliability and excellent heat dissipation is provided. A process for producing an aluminum alloy radiator is also provided which has improved adhesion between the radiator and the mold resin and can prevent cracking in a resin molded portion.
The aluminum alloy radiator, for a plastic molded type semiconductor device, comprising an anodized aluminum-iron alloy having an iron content of 0.5 to 3.0% by weight or an anodized aluminum-silicon alloy having a silicon content of 0.5 to 3.5% by weight. The process for producing an aluminum alloy radiator for a plastic molded type semiconductor device, comprising the steps of: anodizing an aluminum alloy; and subjecting the anodized aluminum alloy to sealing, wherein the aluminum alloy radiator after the sealing is heat-treated at a temperature of 180 to 250.degree. C.

REFERENCES:
patent: 4012769 (1977-03-01), Edwards et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 5367196 (1994-11-01), Mahulikar et al.
patent: 5403975 (1995-04-01), Pasqualoni

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