Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-08-18
1999-08-03
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257726, 257727, 257718, 361704, 165185, 165 802, 174 163, H05K 720
Patent
active
059329254
ABSTRACT:
An adjustable pressure mount heatsink subassembly (10) is provided for use with an electronic chip component (16). The system (10) includes a heatsink portion (12) having a block (28) which has a formed thereon to extend the lateral dimension of the circuit board portion (20) of the chip component (16). A mounting subassembly (14) is, in the preferred embodiment, disposed substantially within the transverse channel (34) and includes a spring clip (40) having a threaded aperture (44) centrally located in a pretensioned arc portion (46) and a pair of opposed end portions (48) for engaging the circuit board portion board edges (26). The pressure of attachment is adjusted by a threaded screw (42) which extends through the threaded aperture (44) and engages the channel floor (36) of the heatsink block (28). An optional nonconductive coating (52) is provided on the clip ends (48) in order to prevent unintended electrical conductance. Alternative embodiments (410) and (510) include, respectively, an overlarge contact surface (430) with clip apertures (456) to facilitate board engagement, and a a receiving recess (560) for mating with a glob portion (19) surrounding the heat producing chip (17) on the electronic component (16). The system (10) is especially adapted for use with surface mounted components such as ball grid arrays where a narrow inter-board gap (23) is typical.
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Guernsey Larry B.
Hughes Michael J.
Intricast, Inc.
Williams Alexander Oscar
LandOfFree
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