Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-04-04
1998-02-17
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257727, 257719, H05K 720, H05K 330, H01L 2324
Patent
active
057194432
ABSTRACT:
A thermal conduction module comprises a base plate for holding a chip substrate, an integrated circuit chip substrate mounted in the base plate and a cover plate having a surface facing the chip substrate. A movable spacer is secured adjacent to the periphery of the cover plate or the base plate, and is adjustable to a predetermined distance away from the cover plate or base plate. A gap for insertion of a thermally conductive paste may be created between chips mounted on the substrate and the cover plate surface facing the chip substrate by adjustment of the spacer to a desired distance from the cover plate or base plate.
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Ahsan Aziz M.
International Business Machines - Corporation
Peterson Peter W.
Thomas Tom
Williams Alexander Oscar
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