Adhesively sealed metal electronic package incorporating a multi

Details Adhesively sealed metal electronic package incorporating a multi Adhesively sealed metal electronic package incorporating a multi

1994-12-12

1996-04-02

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257706, 257724, H01L 2334

Patent

active

055043720

ABSTRACT:
There is provided a leadframe assembly for supporting a hybrid circuit. The hybrid circuit is supported by either the base of an electronic package or by a die attach paddle and electrically interconnected to a leadframe by wire bonds. A plurality of semiconductor devices are mounted on the assembly and supported by either metallization pads formed on the hybrid circuit, a dielectric layer of the hybrid circuit, a die attach paddle, a metallic package component or combinations thereof.

REFERENCES:
patent: 3537907 (1970-11-01), Wilson
patent: 3702427 (1972-11-01), Learn et al.
patent: 3784440 (1974-01-01), Grunwald et al.
patent: 4042952 (1977-08-01), Kraybill
patent: 4103318 (1978-07-01), Schwede
patent: 4105861 (1978-08-01), Hascoe
patent: 4461924 (1984-07-01), Butt
patent: 4492730 (1985-01-01), Oishi et al.
patent: 4495378 (1985-01-01), Dotzer et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4611745 (1986-09-01), Nakahashi et al.
patent: 4619741 (1986-10-01), Minten et al.
patent: 4649416 (1987-03-01), Barkowski et al.
patent: 4695515 (1987-09-01), Shirai et al.
patent: 4767674 (1988-08-01), Shirai et al.
patent: 4835061 (1989-05-01), Ohta et al.
patent: 4862323 (1989-08-01), Butt
patent: 4888449 (1989-12-01), Crane et al.
patent: 4899256 (1990-02-01), Sway-Tin
patent: 4926242 (1990-05-01), Itoh et al.
patent: 4939316 (1990-07-01), Mahulikar et al.
patent: 4943468 (1990-07-01), Gordon et al.
patent: 4963697 (1990-10-01), Peterson et al.
patent: 4997517 (1991-03-01), Parthasarathi
patent: 5025114 (1991-06-01), Braden
patent: 5044074 (1991-09-01), Hadwiger et al.
patent: 5055967 (1991-10-01), Sukonnik et al.
patent: 5066368 (1991-11-01), Pasqualoni et al.
patent: 5068708 (1991-11-01), Newman
patent: 5077595 (1991-12-01), Iukunaga
patent: 5098864 (1992-03-01), Mahulikar
patent: 5121293 (1992-06-01), Conte
patent: 5124783 (1992-06-01), Sawaya
Markstein "Multichip Modules Pursue Wafer Scale Performance" appearing in Electronic Packing & Production, vol. 31, No. 10. Oct. 1991, pp. 40-45.
Hodson "hybrid Circuits Meet the Challenge of Size, Power and Flexibility" appearing in Electronic Packaging & Production, vol. 31, No. 10, Oct. 1991 pp. 60-64.
B. Levine "Multichip Modules Join Arsenal" appearing in Electronic News, vol. 38, No. 1917. Jun. 22, 1992. at pp. 1 and 22.

Affiliated with

Also associated with

Rating

Adhesively sealed metal electronic package incorporating a multi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesively sealed metal electronic package incorporating a multi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesively sealed metal electronic package incorporating a multi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2018431