Air-packed CCD images package and a mold for manufacturing there

Details Air-packed CCD images package and a mold for manufacturing there Air-packed CCD images package and a mold for manufacturing there

1995-09-05

1999-12-07

Munson, Gene M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257666, 257753, 257787, 257797, 257434, H01L 2308, H01L 310203, H01L 23495, H01L 2328

Patent

active

059988622

ABSTRACT:
A plastic lid having a cavity portion is put to cover a pedestal from its front-surface side to its side-surface side, the pedestal having a semiconductor chip mounted thereon. An adhesive agent is charged into a space between the plastic lid and the pedestal so as to bond the plastic lid with the pedestal. Accordingly, a window frame is not necessary, corona discharge treatment or the like is not necessary, and it is therefore not necessary to use a B-stage thermosetting adhesive agent to thereby reduce the manufacturing cost of a semiconductor device of a hollow package structure having such a plastic lid. If a UV radiation setting adhesive agent or a visible radiation setting adhesive agent is used as the adhesive agent, cure time in bonding can be reduced.

REFERENCES:
patent: 4480262 (1984-10-01), Butt
patent: 4814943 (1989-03-01), Okuaki
patent: 4884125 (1989-11-01), Miura
patent: 5016084 (1991-05-01), Nakao

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