Adhesive tape, connected structure and semiconductor package

Details Adhesive tape, connected structure and semiconductor package Adhesive tape, connected structure and semiconductor package

2007-04-25

2010-11-23

Everhart, Caridad M (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23068, C257SE23116, C257SE23001

Reexamination Certificate

active

07838984

ABSTRACT:
An adhesive tape101electrically connecting conductive components includes a resin layer132containing a thermosetting resin, a solder powder103and a curing agent. The solder powder103and the curing agent reside in the resin layer132, the curing temperature T1of the resin layer132and the melting point T2of the solder powder103satisfy T1≧T2+20° C., wherein the resin layer132shows a melt viscosity of 50 Pa·s or above and 5000 Pa·s or below, at the melting point T2of the solder powder103.

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