LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Optimized electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Optoelectronic semiconductor package device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Organic pin grid array flip chip carrier package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Overmolded semiconductor device having solder ball and edge lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package and optoelectronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package and package module of the package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package board for multiple-pin ball grid array package,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package board having internal terminal interconnection and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package circuit board with a reduced number of pins and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package construction for integrated circuit chip with bypass cap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package design and method of manufacture for chip grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for a semiconductor device comprising a plurality of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for accommodating electronic parts, semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for electronic device and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for housing a semiconductor element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for microwave integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for multiple high power electrical components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for packaging a semiconductor device suitable for being

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Package for parallel subelement semiconductor devices