Optimized electronic package

Details Optimized electronic package Optimized electronic package

2005-05-17

2005-05-17

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S690000, C257S678000

Reexamination Certificate

active

06894382

ABSTRACT:
An electronic package for use with a printed circuit board is provided. The electronic package includes a ground layer having an upper and lower section, a semiconductor chip, a conductive signal layer and a ground plane having a first section electrically connected to the upper section of the ground layer and a second section substantially planar with said lower section of said ground layer, the second section of the ground plane having an additional area to prevent cracking of a solder connection between the ground layer, the ground plane and the printed circuit board.

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patent: 3007833 (1991-01-01), None
patent: 3007833 (1999-11-01), None

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