Optimized electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Details

C257S690000, C257S678000

Reexamination Certificate

active

06894382

ABSTRACT:
An electronic package for use with a printed circuit board is provided. The electronic package includes a ground layer having an upper and lower section, a semiconductor chip, a conductive signal layer and a ground plane having a first section electrically connected to the upper section of the ground layer and a second section substantially planar with said lower section of said ground layer, the second section of the ground plane having an additional area to prevent cracking of a solder connection between the ground layer, the ground plane and the printed circuit board.

REFERENCES:
patent: 5639694 (1997-06-01), Diffenderfer et al.
patent: 5814877 (1998-09-01), Diffenderfer et al.
patent: 6072239 (2000-06-01), Yoneda et al.
patent: 6376921 (2002-04-01), Yoneda et al.
patent: 6455348 (2002-09-01), Yamaguchi
patent: 6643433 (2003-11-01), Fukase et al.
patent: 20030062628 (2003-04-01), Lee et al.
patent: 20040070080 (2004-04-01), Pendse
patent: 20040169273 (2004-09-01), Chiang et al.
patent: 20040195701 (2004-10-01), Attarwala
patent: 3007833 (1991-01-01), None
patent: 3007833 (1999-11-01), None

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