Package and optoelectronic device

Details Package and optoelectronic device Package and optoelectronic device

1997-07-29

2000-03-07

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257 99, 257433, 257708, H01L 2348, H01L 3300, H01L 310203, H01L 23043

Patent

active

060344245

ABSTRACT:
A low-capacitance package having a wide hole, an L-shaped lead pin, other linear lead pins, an insulating material filling in the hole for fixing the L-shaped lead pin and another pin in the hole. Projecting from the hole, the horizontal part of the L-shaped pin is separated from the insulating material and stands higher than the surface of the package. A semiconductor device chip is fixed directly on the horizontal part of the L-shaped pin.

REFERENCES:
patent: 3805347 (1974-04-01), Collins et al.
patent: 4047075 (1977-09-01), Schoberl
patent: 5179461 (1993-01-01), Blauvelt
patent: 5258628 (1993-11-01), Tanaka et al.
patent: 5656847 (1997-08-01), Okazaki et al.
patent: 5783819 (1998-07-01), Shimoyama et al.
patent: 5798536 (1998-08-01), Tsutsui
Optoelectronics--Devices and Technologies, vol. 9 No. 2 pp. 167-176, Jun. 1994 Surface Emitting Lasers, Kenichi IGA.

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