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Buffer coating having a physical mixture of high toughness...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Carrier structure for semiconductor chip and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Ceramic coated plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Chip package structure and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Chip package with transfer mold underfill

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Chip packaging compositions, packages and systems made...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Chip size package with stress relieving internal terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate

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Circuit device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Circuit device and method of manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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CMOS sensors having charge pushing regions

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Coated semiconductor die/leadframe assembly and method for coati

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Coating material over electrodes to support organic synthesis

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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COF packaged semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Compliant semiconductor chip package with fan-out leads and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Compositions for protecting semiconductor elements and semicondu

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Compound filled in lead IC packaging product

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Conductive adhesive compositions containing an alloy filler...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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