Circuit device and method for manufacturing the same

Details Circuit device and method for manufacturing the same Circuit device and method for manufacturing the same

2006-07-11

2006-07-11

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S680000, C438S127000

Reexamination Certificate

active

07075188

ABSTRACT:
In order to provide a circuit device10where a second circuit element15B is exposed from a sealing resin16, a circuit device10A comprises: an island12to whose top a first circuit element15A is fixedly fitted; a plurality of leads11which are extended around the island12and electrically connected to the first circuit element15A; a sealing resin16which seals the first circuit element15A, the island12, and leads11and forms a cavity portion18; and a second circuit element15B stored in the cavity portion18. Accordingly, since the second circuit element15B can be externally provided, the degree of freedom for mounting can be improved.

REFERENCES:
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 6420204 (2002-07-01), Glenn
patent: 6483030 (2002-11-01), Glenn et al.
patent: 6624921 (2003-09-01), Glenn et al.
patent: 6643919 (2003-11-01), Huang
patent: 6774469 (2004-08-01), Utsumi
patent: 6815829 (2004-11-01), Shibata
patent: 6828674 (2004-12-01), Karpman
patent: 6849915 (2005-02-01), Tsai

Affiliated with

Also associated with

Rating

Circuit device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3568875