Ceramic coated plastic package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

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Details

257787, 257687, H01L 2329

Patent

active

056729154

ABSTRACT:
The invention is to a semiconductor package and the method of making the package. A moisture resistant coating such as a ceramic material is applied over a plastic packaged semiconductor device to seal the package from moisture.

REFERENCES:
patent: 3831265 (1974-08-01), Louzon et al.
patent: 4117508 (1978-09-01), Koenig
patent: 4477828 (1984-10-01), Scherer
patent: 4887148 (1989-12-01), Mu
patent: 5140384 (1992-08-01), Tanaka

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