Buffer coating having a physical mixture of high toughness...

Details Buffer coating having a physical mixture of high toughness... Buffer coating having a physical mixture of high toughness...

2006-09-06

2010-06-08

Cao, Phat X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S788000, C257S789000

Reexamination Certificate

active

07732936

ABSTRACT:
Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein, wherein the buffer coating is provided by mechanically blending a first polymer with at least a second polymer. The mechanically blended polymers producing a buffer coating that provides a barrier that is has an increased toughness and decreased shrinkage.

REFERENCES:
patent: 5053288 (1991-10-01), Hashimoto et al.
patent: 2005/0123776 (2005-06-01), Yoshikawa
patent: 2006/0116476 (2006-06-01), Cheng
patent: 2006/0154078 (2006-07-01), Watanabe et al.

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