Compositions for protecting semiconductor elements and semicondu

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

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257789, 257790, 257791, 257795, 427 58, 427 96, 427387, 524863, 528 12, 528 34, H01L 2329

Patent

active

055613292

ABSTRACT:
Curable silicone compositions comprise either (a) microparticles of a fluororesin which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture and heat resistance.

REFERENCES:
patent: 4318939 (1982-03-01), Wong
patent: 4499149 (1985-02-01), Berger
patent: 4888226 (1989-12-01), Wong
patent: 5051275 (1991-09-01), Wong
patent: 5216807 (1993-06-01), Yoshizawa et al.
patent: 5246995 (1993-09-01), Murakami et al.
patent: 5391924 (1995-02-01), Uchida et al.
patent: 5442237 (1995-08-01), Hughes et al.

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