Chip packaging compositions, packages and systems made...

Details Chip packaging compositions, packages and systems made... Chip packaging compositions, packages and systems made...

2006-08-08

2006-08-08

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S789000, C257S788000, C257S709000, C257S702000

Reexamination Certificate

active

07088010

ABSTRACT:
A system for chip packaging includes an adamantoid packaging composition. The adamantoid composition ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In an embodiment, the system includes a packaging composition that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a chip package that uses an adamantoid packaging composition.

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