Coated semiconductor die/leadframe assembly and method for coati

Details Coated semiconductor die/leadframe assembly and method for coati Coated semiconductor die/leadframe assembly and method for coati

1997-10-08

2000-08-22

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257783, 257792, 257666, H01L 2328, H01L 2329, H01L 23495

Patent

active

061076902

ABSTRACT:
A novel method for coating a semiconductor die/leadframe assembly prior to encapsulation. The method of the invention comprises coating the exposed surfaces of the die and the inner lead fingers in a die/leadframe assembly with an adhesion promoting material, typically a polyimide. A solution of the adhesion promoting material is dispensed from a spray nozzle to coat the die and the inner lead fingers. Preferably, all exposed surfaces of the die, the inner lead fingers and the bond wires are coated prior to encapsulation. The invention also provides an improved semiconductor package that includes a semiconductor die/leadframe assembly and a layer of adhesion promoting material coating the exposed surfaces of the die and the inner lead fingers. The die/leadframe assembly is encapsulated in a molded plastic package.

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