Chip module

Details Chip module Chip module

2008-07-08

2008-07-08

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S679000, C257S687000, C257S789000, C257S795000, C257S783000, C257SE23064, C257SE23114, C257SE23116

Reexamination Certificate

active

07397140

ABSTRACT:
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.

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